Herve Daniel

Herve Daniel

ISP IP Architect, Huawei

En poste chez Huawei

Précédents : Texas Instruments


Précédents : Ecole Polytechnique De Montréal


    En résumé

    Graduated in Electronic Engineering (specializations in Microelectronic and signal Processing), with 14 years experience in design of digital circuit, Architecture and IP design lead for Wireless Texas instruments application processors (OMAP). Excited about shaping the future of a semiconductor company by defining and architecting the next generation products. Committed to high quality execution & enthusiast.


Architecture and Design lead

Chez Texas Instruments

De 2006 à 2010
Define the architecture, led the design and verification team for the development of an HD Video IP for wireless applications used in OMAP4 and OMAP5.

Architect and Design lead

Chez Texas Instruments

De 2004 à 2006
As a member of the OMAP3 multimedia development team, I was in charge of defining the micro-architecture and design of a loop-filter hardware accelerator, targeting D1 resolution at 30 FPS and supporting multiple codec such as H264, MPEG2/4, WMV9 and RealVideo:

Architecure and Digital Design

Chez Texas Instruments

De 1999 à 2004
Development of tightly-coupled hardware accelerator extension for the C55 DSP of Texas Instruments, accelerating data computation for specific applications while decreasing the power consumption. •Responsible of the specification, design, verification and C model (cycle accurate) delivery of ...
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  • Architecture
  • C / C+
  • Design
  • digital design
  • Fpga
  • Low power
  • Semiconducteur
  • SOC
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