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Nicolas GOURGUES

Marseille

En résumé

Pas de description

Entreprises

  • Traxens - Project Manager - Custom Project

    Marseille 2017 - maintenant
  • Inside Secure - Product Manager - Content Protection

    Meyreuil 2016 - 2017
  • Inside Secure - Product Management Engineer - Mobile Software Protection & HCE

    Meyreuil 2015 - 2016
  • Inside Secure - Product Management Engineer - HW Secure Element

    Meyreuil 2014 - 2014
  • Inside Secure - Industrialization & Packaging Engineer

    Meyreuil 2010 - 2014 IC Package Line Leader (Frame based and WLCSP) :
    - IC Packaging : Study, Definition et Industrialization in our Asian manufacturers
    o Production Subcontrator followup (Asian ones)
    o Packaging studies based on Standards process (QFN, SOIC, SSOP) and Advanced process (MCM, Stacking, WLCSP)
    o Prototype to Production and Qualification
    - Co-Design : pre-study packaging on futur product in Layout step for optimisation.
  • INSIDE Contactless - RF & IC Packaging Engineer

    2007 - 2010 I had a dual role during this period.

    RF Test Lab responsible :
    Update the « RF Test & validation Lab » to « pre-certification Lab » internal.
    - Continuous improvement of Test material, and Test procedures setup,
    - Follow-up (out of comity) of Standards ISO10373, 14443 & 15693, of Directives CCPS and EMVCo.
    - Follow-up and monitoring with Official external Certified Lab (FIME, RFI, Hyperion, Soliatis)
    - Ensure certification « One-Shot » of products for VISA, MCARD, DISCOVER, …
    Test of Smart Card products and analysis of parameters improvement needed.
    - Characterization Test and Tuning frequency with ISO benches by “Schmoos”
    - Validation Test and fine Tunning of clock/consumption on RF EMV benches.

    IC Packaging Engineer: Study, definition and outsourced industrialization.
    Production subcontractor followup, new packages development from prototyping to qualification, Co-Design.
  • DM Radiocom - RF and Electronique Engineer

    2003 - 2006 I worked in a team who has developped a complex project for « Radio Transmission for Mobile Robotic ».
    I had to take care of the Development of Analog Radio frequency part:
    _ Component selection, Simulations, Layout, (softwares Genesys, ORCAD)
    _ Assembly and Validation of PCB (CMS components, Oscilloscope, Spectrum Analyzer)
    _ Global System Communication (MicroChip PIC Programming in assembler)
    I also had to manage the Global System Integration:
    _ Electric Supply of all different modules (Puissance, Dissipation)
    _ Development of « Fond de Panier », (Global project view, digitals signals)
    _ Mechanical Integration (plans, machining, assembly)

Formations

Pas de formation renseignée

Réseau

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